SY-EPC-LPC Active-Load-Tester Specifications

Equipment Characteristics

Equipment Architecture

Equipment Layout

Equipment Specifications

Equipment Usage

Equipment Protections

Equipment Auto-test

Equipment Software Part

Production Contract & Contact History

Equipment Characteristics

Power In	Ph+N ~ 230V/xxA
Item Type	Active Load (Reliability & Test Type) Tester

Equipment Architecture

This tester is an active load for testing AC-DC power supplies. It provides:

A capability of at least 12 load channels in the power range of 200 W_max, limited by:
48V_max x 50A_max working area.
Different and per channel adjustable load current.
:

Equipment Layout

Tester is divided in several internal parts:

Auxiliary Power Supply
- In Work documentation web / local dir
- Located in the irradiated area, and containing the devices (component) under test.
- An effort on the cost of this device is mandatory.
- The Head ideally self protects itself, and indicates to the tester-control-module the required type test.
- It includes
  - All the devices under tests, which can be connected:
    - Directly on the head board, the cheaper solution.
    - Using a specific additional board
      (dedicated to facilities like PSI with 5-cm irradiation beam diameter, concentrating the components as much as possible, and dealing with SMD mounting requirements).
    - Simply using the available connector.
  - Minimum electronics since considered as 1-use only, and then be replaced for each test; basically only passive devices.
  - The manual switches coding test sequence - conditions.
  - At least 2 thermal probes per head (one internal to the head placed on the PCB, and another which can be put directly on one of the component under test).
  Mechanical Overview and various Device Under Test configurations .vsd

Active Load Part

In Work documentation web / local dir
It includes
Water Cooled Base Plate + Power Mosfets .vsd

Tester Front Panel Control Tester Front Panel Control

Power supply short specifications / Interface

Control Card Power Supply:
This line can be doubled if consumption of the control card exceeds the current level showed below.

	Flat Cable 2x5 pins [0.35A/pin]_MAX
Pin	Volt	Comments
1	+15V
2	+15V
3	+5V
4	+5V
5	0V/GND
6	0V/GND
7	0V/GND
8	0V/GND
9	-15V
10	-15V

General Control Card Power Supply Definition

[-25V..+25V] Power Supply:
This single power line is used for all 3 heads, since it is first individually set for each component through the control card, and then sent to the corresponding heads / D.U.T.

	MATE-N-LOK [5A/pin]_MAX
Pin	Volt	Comments
1	+25V	Power Line used for V1 signal (Gate voltage).
2	0V	Power Line used for V1 signal (Gate voltage). This line is intended to be GND grounded.
3	-25V	Power Line used for V1 signal (Gate voltage).

[-25..+25V] Power Supply Interface / Signals

[0..1400V] PSU Control Signals:
Each [0..1400V] PSU (1/head) gets its proper control connector, to be able to set the Bus voltage for each head (not at the level of the D.U.T.)

[0..1400V] PSU delivers 4 power lines in reality, all of them being linked and equally controlled by the [0..10V] REF signal.
- [0..-1400V]
- [0..-140V]
- [0..140V]
- [0..1400V]
- 12bits DAC controlled (Step of less than 0.5V on 1400V)

A FAST-ABORT signal is available for direct control of the converter, when DISABLE signal is used for control unit.
Over voltage Bits set at the level of the head prevents the [0..1400V] PSU to deliver too high voltage level referred to the DUT being tested.
- [0..-1400V]
- [0..-140V]
- [0..140V]
- [0..1400V]
- 3bits controlled (Step of 175V on 1400V)
  111 <=> 175V limitation, 000 <=> 1400V limitation

	Flat Cable 2x7 pins [0.35A/pin]_MAX
Pin	Name	Range	Comments
1	FAULT	0/1	Any fault detected at the level of the PSU unit is reported on this line
2	0V/GND	N.A.
3	FAST-ABORT	0/1	An interlock which prevents the PSU to start.
4	0V/GND	N.A.
5	DISABLE	0/1	Software line to enable / disable PSU.
6	0V/GND	N.A.
7	OVER.VOLT.BIT.0	0/1	Lower bit for over voltage protection setting.
8	OVER.VOLT.BIT.1	0/1	Medium bit for over voltage protection setting.
9	OVER.VOLT.BIT.2	0/1	Large bit for over voltage protection setting.
10	0V/GND	N.A.
11	SPARE	N.A.
12	0V/GND	N.A.
13	VREF+	[0..10V]/GND	Differential input on PSU side. To be expected to be referred to 0V/Ground. 10V = Maximum Ouput voltage PSU can provide.
14	VREF- (0V/GND)	[0..10V]/GND	Differential input on PSU side. To be expected to be 0V connected from emission side.

[0..1400V] Power Supply Interface / Signals

A Standard computer laptop:
- Located in a radiation safe area.
- No specific card internally mounted required: a USB Serial adapter must ideally be sufficient to communicate with the control module.
- High-Level Software, ideally developped with Labview.

Equipment Specifications

Equipment Usage

The Head is designed in such a way that different kind of tests are possible keeping the same head (low-cost non-reusable part), simply modifying the way the control part behaves, and adjusting the resistance and capacitor values.

R2E-EPC-Switch-Tester simplified Architecture / Topology .vsd

Type Test	Comments
Type Test	Goal of the experiment, and results expected.	Test Conditions, limits of interest.
S.E.	Determine the cross section (trying not to really crash the component under test liming when possible the event energy inside it) of the component, approching as much as possible the limits (auto-step-back when touching it).	Even if nominal operation conditions are below the maximum ratings of the component, it is always required to find the effective limit of operation of the component in this test.
Treshold.Monitor	Determine the effect of the cumulative dose (displacement damage + ionizing dose) on the conducting treshold of the component. A current loop based on the component current ouput control the gate voltage or base current to determine its evolution.	If nominal conditions are always used for this test, some margin are considered, always trying to find the most degrading conditions for the parameters considered.
I.Leakage.Monitor	Determine the effect of the cumulative dose, but also some degradation of S.E type like S.E.G.D. for Mosfets.	Even if nominal operation conditions are below the maximum ratings of the component, it is always required to find the effective limit of operation of the component in this test.

Different tests description.

Type Test	Component Values
Type Test	V1 [V]	V2 [V]	R1 [Ohms]	C1 [F]	C2 [F]	R2 [Ohms]	Rc1+2 [Ohms]	C3 [F]
S.E. (Mosfet)	[0..-15V] _5V.step	[0.5xV_max..V_max] _{0.1xV_max.step}	10k	10n	10n	10	1k	1u
Treshold.Monitor (Mosfet)	auto-adjustable To follow I_R2=1mA	[1xV_circuit..2xV_circuit] V_circuit being voltage applied in the application.	10k	10n	10n	100	1k	1u
I.Leakage.Monitor (Mosfet)	[-5..-15V] _5V.step	[0.5xV_max..V_max] _{0.1xV_max.step}	1M	10n	10n	1M	1k	1u

Different Head Configuration vs test applied in case of a transistor Mosfet.

Some example of possible uses of the tester are described below. The 3 heads can be used for testing different datecode of a component (same REF), when it is also possible to test different references on the same kind of tests (S.E.), or even to mix different test configuration, and in very unlikely cases, mixing test configuration + component references.

It is nevertheless important to consider that

only one unique reference can be used per head, since sharing the same voltage bus (V2).
each V1 signal applied to each component has to be different since possibly used for regulating an individual component current (treshold)

Type Test	Configuration
Type Test	Comments and typical use	Head 1 Configuration Settings	Head 2 Configuration Settings	Head 3 Configuration Settings
S.E. Ref.1≡Head.₁≡Head.₂≡Head.₃ Ref.1≡Head.₁, Ref.2≡Head.₂ etc...	Different batches (datecode) of same Ref.1 component being provided has to be validated, or each Head goes with a dedicated Ref.	S.E. Head₁.V1≡[0..-15V] Head₁.V2≡[0.5xV_max..V_max] Head_1,2,3 individually independant	S.E. Head₂.V1≡[0..-15V] Head₂.V2≡[0.5xV_max..V_max] Head_1,2,3 individually independant	S.E. Head₃.V1≡[0..-15V] Head₃.V2≡[0.5xV_max..V_max] Head_1,2,3 individually independant
S.E.+Treshold+I.Leak full characterization of a unique REf.1 component.	One Unique Ref.1 component is considered and each head is used for each required specific test; Heads are then correctly and individually accordingly configured.	S.E. Head₃.V1≡[0..-15V] Head₃.V2≡[0.5xV_max..V_max] Head₃ configured for S.E	Treshold Head₂.V1≡auto-adjustable To follow I_R2=1mA Head₂.V2≡[V_circuit..2xV_circuit] Head₂ configured for Treshold Monitoring.	I.Leak Head₁.V1≡[0..-15V] Head₁.V2≡[0.5xV_max..V_max] Head₁ configured for I.leak

Different tests using specific configure head, with one control part managing each head through specific actions.

Equipment Protection Mechanisms

Since the tester can be used in many different ways, some space naturally exists for human errors, with potential dramatic consequences (control/power part can deliver up to 1.4kV). To limit the risk of errors and to protect the Devices Under Tests contained in the Head parts, some mechanism are foreseen, taking in account the following principles

Labview or control digital part can go mad at any moment, requiring to the power part (3 different individually controllable power supplies [0..1400V] in each control / part tester part) a much too high voltage across the D.U.Ts.
It is likely that only the head parts (non reusable parts) will be changed in some testing locations (CNRAD), while the base part will stay in place, being controlled adequately by the Labview software.

The implementation of these auto-protect mechanism are relying on:

A disconnected head will prevent any powering (V1 or V2) from the control / power part, being then interlocked by hardware lines. A simple basic presence jumper has to be foreseen in the head.
Head will give the adequate signature to the control / power part to only safely receive:
- The required test sequence: S.E, threshold monitoring or I.leakage monitoring coding the sequence on 3 internal to head switches (8 theoritical test programs)
- The required maximum level of voltage levels being applied on V2 (V1 safely limited to +/-25V, considered as non-critical) coding the maximum value on 3 internal to head switches (8 level of voltages in the range [0..1400V])

Equipment Auto-Test Mechanisms

Some auto-test mechanism shall be implemented, especially in the cases of S.E tests, to ensure the real detection capability of the whole system. This auto-test feature can rely on a pulse command voltage at the level of the device and under safe powering level conditions, in order to create a short trigger signature to check the correct tester response.

Equipment Software

Labview Software will be used to control the tester and is ideally compatible Linux / Windows.

Production Contract & Contact History

Developped	CERN SY-EPC-LPC
	2011-2012
	Yves THUREL
	Benoit FAVRE
	Error processing SSI file
Manufactured	CERN
Production	xx Pc